XDS H.100 PCI BRI Board (INS-Net64)

Product Part Number: 257L050 (4 port)

Product Part Number: 257L049 (16 port)

PC Form Factor: PCI
TDM Bus Type: H.100

Digital Ports: 4 / 16 Basic Rate ISDN S/T Interface

Bus Capacities:

H.100 - 4096 timeslots
BRI - 8 / 32 B Channels

Each of the INS-Net 64 BRI ports provide an S/T interface, and can be configured as either NT (for connection to ISDN phonesets) or TE (for connection to the Central Office). Layer 2 and Layer 3 access is available. The rear panel provides a single SCSI-III amphenol connector which is intended for use with mating cable 251D037. When used with this cable, the sixteen ports will map to two standard RJ21 amphenols. The rear panel of the four port board presents four RJ45 modular interface jacks.

Click here to download the XDS H.100 INS-Net 64 BRI technical manual


Additional Product Specifications

BRI Interface: (4 port board)

2B channels + 1D channel) x 4
Four modular RJ45 interface jacks provide direct connection to the board.

BRI Interface: (16 port board)

2B channels + 1D channel) x 16
SCSI-III adapter cable connects to PCI rear panel to present 16 ports on two RJ21 amphenols.

Signaling Protocols:

Layer 2 and Layer 3 messaging supported
Layer 3 protocol stacks: INS-Net 64

DSP Resources:

DTMF Detector (each port)
Energy Detector (each port)
DTMF Generator (each port)
all Progress Tone Generation (each B-channel)
1004Hz Calibration Tone Generation
32 Bi-directional voice resource channels

Temperature Extremes:

Operating: 0°C (+32°F) to +50°C (+122°F)
Storage: -40°C (-40°F) to +70°C (+158°F)

Ambient Humidity:

Designed to withstand ambient relative humidity from 0% to 95% non-condensing in both operating and storage conditions.


Designed to conform to PCI-SIG mechanical specifications for full-length PCI cards.


50,000 hours

Electrical Requirements:

+5 volts +5% @ 1.5 amps maximum
-48 volts, maximum current per port 100mA  (required only for PS1 power option)
+12 volts, +3 volts, and -5 volts are not required. ©