Boards

XDS PCI / PCIe HMP T1/E1 Interface Board

Product Part Number:

266L029 (4-span PCI without echo cancellation)
266L023 (8-span PCI without echo cancellation)
266L019 (4-span PCI with echo cancellation)
266L016 (8-span PCI with echo cancellation)

267L017 (4-span PCIe without echo cancellation)
267L016 (8-span PCIe without echo cancellation)
267L011 (4-span PCIe with echo cancellation)
267L009 (8-span PCIe with echo cancellaton)

PC Form Factor: 2U Half-length PCI / PCIe
Digital T1/E1 spans: 4 or 8


The PCI / PCI Express Host Media Processing T1/E1 board is designed to provide either 4 or 8 digital T1/E1 spans for use in PC-based telephony systems running Asterisk® software. Span types are software selectable, including a mix of both T1 and E1 interfaces on the same board. Each span can be configured for use as Primary Rate ISDN, or for Robbed Bit or Channel Associated Signaling. In addition to the basic ability to place and receive calls, the PCI / PCIe HMP T1/E1 interface board supports additional features such as optional echo cancellation and a logging (line-tap) capability for call monitoring of existing digital spans. A software device driver and channel driver are available for use with Asterisk 1.8 and 11, operating within a Linux environment (kernel 2.6). The software driver package has been verified under a number of common Linux variants, including Debian, Ubuntu, and CentOS.

Click here to download the XDS HMP T1/E1 Hardware Technical manual.

Click here to download the XDS HMP T1/E1 Software Interface manual.



Additional Product Specifications


Digital Interface:

Spans: 4 or 8
Span Types (4-span board): 4 T1, 4 E1, or 2 T1 + 2 E1
Span Types (8-span board): 8 T1, 8 E1, or 4 T1 + 4 E1
Connector: RJ45 x 4

T1 Interface Specifications:

24 channels (Robbed Bit T1)
Each span is software selectable as Customer Premise Equipment (CPE) or Central Office (CO)
Framing: D4 / ESF
Zero Suppression: AMI / B8ZS

23 B-channels + 1 D-channel (PRI)
Each span is software selectable as Network Termination (NT) or Terminal Equipment (TE)

T1 Line Protocols: E&M, Ground Start, Loop Start, Q.421, none
PRI Signaling Protocols: Layer 3 protocol stacks include NI-1, elements of NI-2 and NI-3, ANSI T1.607, ETSI 102

E1 Interface Specifications:

30 channels (Channel Associated Signaling)
Each span is software selectable as Customer Premise Equipment (CPE) or Central Office (CO)
Framing: CRC4 / non-CRC4
Zero Suppression: AMI / HDB3

30 B-channels + 1 D-channel (PRA)
Each span is software selectable as Network Termination (NT) or Terminal Equipment (TE)

E1 CAS Line Protocols: E&M, Ground Start, Loop Start, Q.421, none

PRI Signaling Protocols: Layer 3 protocol stacks supporting EuroISDN

Temperature Extremes:
Operating: 0°C (+32°F) to +50°C (+122°F)
Storage: -40°C (-40°F) to +70°C (+158°F)


Ambient Humidity:
Designed to withstand ambient relative humidity from 0% to 95% non-condensing in both operating and storage conditions.


Mechanical:
Designed to conform to PCI-SIG® mechanical specifications for PCI or PCI Express cards.


MTBF:
50,000 hours

Electrical Requirements:

PCI HMP T1/E1 Interface Board:
+3.3 volts 60 mA typical, 100 mA maximum w/o echo cancellation
  300 mA typical, 800 mA maximum with echo cancellation
+5 volts 1.0 A typical, 1.5 A maximum
   
 PCI Express HMP T1/E1 InterfaceBoard:
+3.3 volts 100 mA typical, 150 mA maximum w/o echo canceller
  350 mA typical, 850 mA maximum with echo canceller
+12 volts 500 mA typical, 750 mA maximum

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