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When system needs become too great to be handled within a single PC chassis, Amtelco has a solution. The XDS MC-3 Fiber Link Multi-Chassis Interconnect board provides MVIP system expansion of 4,800+ non-blocking time slots between either local or off-site locations. The board utilizes Fiber OC3 (SONET Framing) links to connect between chassis up to 2,000 meters apart. The XDS MC-3 board allows flexible sourcing and control of system clocks. A clock fallback feature is included for recovery in the event of an external clock failure. This board is also equipped for enhanced conferencing capability, with DTMF detection and tone clamping. Up to 128 ports may be combined in 42 simultaneous conferences, depending on specific user needs. The conferencing functions are independent of the multi-chassis interconnections. A MVIP-compliant command set allows for maximum PC driver efficiency. The MC3 Multi-Chassis Interconnect board can share the messaging scheme with other XDS boards. Software programmable memory mapping is available anywhere in the 16 Mbyte PC address space, and 2K of Dual Ported Ram is mapped in the PC to conserve I/O addresses and increase performance. DOS, OS/2, UNIXWARE, Windows NT, and Solaris drivers are available. This board is enhanced MVIP-90 compliant. The XDS MC-3 board is upward compatible at the API level with AMTELCO's MC1 board. This compatibility allows easy transition from AMTELCO MC1 to MC3. Technology covered under patents 5420852, 5341368 and others. |
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